Solder pastes

Printing process


Balver Zinn Solder Paste Cobar OT2

Cobar OT2 is the latest, ROL0 classified “No-Clean” solder paste that is halogen and halide-free and can be combined with SN100C®, SCAN-Ge071 and SAC305 alloys. The OT2 solder paste’s optimized rosin based chemistry offers the best printing and wetting properties up to 250mm/s printing speed. Typical problems with oxidation and miniaturizing, such as  graping or head-in-pillow, are eliminated. For additional information please refer to the product data sheet.


Cobar Solder Paste F3+

XF3+ is a REL0 classified, halide-free “No-Clean” solder paste based on powder type 3 that is available with the leaded and lead-free solder alloys SN62, SN100C®, SCAN-Ge071 and SAC305. Alloys with a melting range provide extremely good anti-tombstoning behaviour for vapour phase and reflow applications. F3+ is available with powder type 4 as HF3+,as well. For additional Information please refer to the product data sheet.


Balver Zinn Solder Paste XM3S

XM3S is a REL1 classified “No-Clean” solder paste especially designed for high reliability applications such as automotive electronics.  It is available with leaded and lead-free powder including SN62 and SAC305. The XM3S formulation is not aggressive and should be soldered under nitrogen. For additional information please refer to the product data sheet.

Dispensing process


Balver Zinn Solder Paste RMA H-1 FDQ

RMA H-1 FDQ is a ROL1 classified, lead-free “No-Clean” solder paste formulation with SN100C®, SN96C and SN97C alloys for dispensing under nitrogenous and atmospheric conditions. RMA H-1 FDQ exhibits a low residue level concentrated around the pad. Long tack time and long stencil life allows reflow profiles with a peak temperature of 235°C - 250°C. It also is suitable for vapour phase soldering at temperatures of 230°C and 240°C. For additional information please refer to the product data sheet.


Cobar dispense paste 325GM5

Dispense solder paste is available in S62, and SAC405 alloy composition. The powder particle size is smaller and the flux content is higher than a standard type 3 printing solder paste to achieve the desired viscosity for dispensing applications. Because the paste is no-clean, residues can safely remain on the PCB.