Cobar OT2 is the latest, ROL0 classified “No-Clean” solder paste that is halogen and halide-free and can be combined with SN100C®, SCAN-Ge071 and SAC305 alloys. The OT2 solder paste’s optimized rosin based chemistry offers the best printing and wetting properties up to 250mm/s printing speed. Typical problems with oxidation and miniaturizing, such as graping or head-in-pillow, are eliminated. For additional information please refer to the product data sheet.
XF3+ is a REL0 classified, halide-free “No-Clean” solder paste based on powder type 3 that is available with the leaded and lead-free solder alloys SN62, SN100C®, SCAN-Ge071 and SAC305. Alloys with a melting range provide extremely good anti-tombstoning behaviour for vapour phase and reflow applications. F3+ is available with powder type 4 as HF3+,as well. For additional Information please refer to the product data sheet.
XM3S is a REL1 classified “No-Clean” solder paste especially designed for high reliability applications such as automotive electronics. It is available with leaded and lead-free powder including SN62 and SAC305. The XM3S formulation is not aggressive and should be soldered under nitrogen. For additional information please refer to the product data sheet.
RMA H-1 FDQ is a ROL1 classified, lead-free “No-Clean” solder paste formulation with SN100C®, SN96C and SN97C alloys for dispensing under nitrogenous and atmospheric conditions. RMA H-1 FDQ exhibits a low residue level concentrated around the pad. Long tack time and long stencil life allows reflow profiles with a peak temperature of 235°C - 250°C. It also is suitable for vapour phase soldering at temperatures of 230°C and 240°C. For additional information please refer to the product data sheet.
325GM5 is a REL1 classified solder paste with the lead-free SAC405 (Sn4Ag0.5Cu) alloy for dispensing. Because the paste is no-clean, residues can safely remain on the PCB. For additional information please refer to the product data sheet.