Alloys

Bars / Solid wires

SN100C®

Balver Zinn lead-free solder SN100C®

SN100C® (Sn0.7CuNiGe) is a nickel-stabilized tin copper lead-free eutectic, containing a small amount of antioxidant germanium. SN100C® shows less dross formation, lower copper dissolution as well as a reduction of bridging and bright and shiny solder joints. The solder is ideal for wave and selective soldering. For additional information please refer to the product data sheet.

SN100CS+

Balver Zinn lead-free solder SN100CS+

BALVER ZINN SOLDER SN100CS+ is a new variant of the unique and highly regarded lead-free solder BALVER ZINN SN100C® with a content of 250ppm (0.025%) of germanium. In the BALVER ZINN SN100C® formulation, Ge plays the role of antioxidant, preferentially reacting with oxygen to protect the solder from the oxidation that results in the formation of dross. Due to the bigger amount of germanium, BALVER ZINN solder SN100CS+ is especially suitable for applications without nitrogen. BALVER ZINN SN100CS+ has all the other advantages that have made BALVER ZINN SN100C® so popular, including substantially reduced copper dissolution. The lower surface tension of the solder surface deoxidized with Ge means better wetting and flow. BALVER ZINN SN100CS+ should be used for the first fill and the top up of a solder pot when it is expected that it might be difficult to maintain Ge at the level required for effective oxidation control. For additional information please refer to the product data sheet.

SN100CL

Balver Zinn Solder SN100CL

SN100CL (Sn0.7CuNiGe) is a lead-free alloy specially developed for the LFHASL process. Like all variations of SN100C®, it is a nickel-stabilized tin copper eutectic, containing a small amount of antioxidant germanium. SN100CL has been successful in the production of lead-free printed circuit boards. For additional information please refer to the product data sheet.

SN100C®-SEL

Balver Zinn Solder SN100C®-SEL

With an increased utilization of supstrates with ENIG pad finishing and the usage of Ni covered component leads (like shielding’s) the solder composition in the selective solder bath will change. Because of lack of copper dissolution, the copper content might decrease and because of high Ni dissolution, the Ni content might increase. The BALVER ZINN SN100C®-SEL has been developed to maintain the nickel and copper concentrations in soldering applications that are sensitive for Ni and/or Cu dissolution. SN100C®-SEL stabilizes the solder bath composition because of the dedicated Ni and Cu contents in the alloy. For additional information please refer to the product data sheet.

SN100CV®

Balver Zinn Solder SN100CV®

BALVER ZINN SOLDER SN100CV® (SnBi1.5Cu0.7NiGe) is a patented version of the worldwide well-known solder SN100C® with the addition of bismuth. SN100CV® is like SN100C® a nickel-stabilized tin-copper solder, containing a small amount of germanium to reduce oxidation. The tensile strength of SN100CV® is approx. 30% higher compared to SN100C® and reaches even higher values than SAC305 because of the presence of bismuth. SN100CV® is a silver- and lead-free solder for high reliability applications. Compared with SN100C®, SN100CV® causes less copper dissolution that allows very stable processes and easy solder bath management. BALVER ZINN SOLDER SN100CV® is an invention of NIHON SUPERIOR® with patent number JP 5872114. BALVER ZINN is worldwide the first licensee and offers SN100CV® as bar, cored wire and solder paste. For additional information please refer to the product data sheet.

SN96C

Balver Zinn solder SN96C

SN96C (Sn3.8Ag0.7Cu) is a well-known lead-free eutectic solder used extensively in Europe. It has been developed for wave, selective and dip soldering applications. It has the lowest melting point of all tin-copper and tin-silver alloys. SN96C meets the requirements of J-STD 006B. For additional information please refer to the product data sheet.

SN97C

Balver Zinn solder SN97C

SN97C (Sn3.0Ag0.5Cu) is a worldwide standard solder with a long history, especially in Japanese electronics production. It has been developed for wave, selective and dip soldering applications. SN97C is a slightly hypereutectic alloy with a melting range of only 1°C and meets the requirements of J-STD 006B. For additional information please refer to the product data sheet.

SCAN-GE – Serie

Balver Zinn solder series SCAN-Ge

The SCAN-Ge series are patented alloys with different contents of copper and silver by addition of nickel and antioxidant germanium. The fine grained microstructure and high ductility of the SCAN-Ge series confer reliability that is similar to that of the well-known lead-free alloy SN100C® and its derivate. For additional information please refer to the product data sheet.

Sn63Pb37

Balver Zinn Solder Sn63Pb37

Sn63Pb37 is a standard tin lead solder alloy for wave and selective soldering. It also can be used for dip tinning. Applicable process temperatures are between 245 – 300°C. We also recommend solder bath temperatures between 245 - 255°C. Sn63PbP is a special alloy for HASL –and wave soldering processes that contains a small amount of phosphorus to reduce the oxidation of solder. For additional information please refer to the product data sheet.

Solder wires

LF 2220 NC

Balver Zinn solder wire LF2220 NC

The REL0 classified “No-Clean” solder wire LF2220 NC has been developed for lead-free rework and touch-up of lead-free circuitry. It leaves minimal non-corrosive residues and provides fast wetting of critical surfaces to form strong joints. It is halide-free and has a standard flux content of 2.2%. LF2220 NC is offered in diameters from 0.3 – 3.5mm and is available in lead-free alloys SN100C®, SN96C and SN97C and leaded. For additional information please refer to the product data sheet.

BRILLIANT B2012

Balver Zinn solder wire Brilliant B2012

The ROL0 classified “No-Clean” solder wire BRILLIANT B2012 is a new halide-free, rosin based formulation ideal for rework and touch-up applications. Main development targets were bright and clear non-corrosive residues and very good wetting and flow ability. It is available in the lead-free alloys SN100C®, SN97C and SN96C in various diameters from 0.3 – 2.5mm with a standard flux content of 2.2%. For additional information please refer to the product data sheet.

µ-WIRE B2012

μ-wire SN100C® B2012

The ROL0 classified “No-Clean” μ-wire SN100C® B2012 is a halide-free, rosin based formulation available in 0.15 and 0.2mm diameters with a solids content of 2.2%. Based on the Brilliant B2012 flux technology it leaves clear residues and shiny solder joints. The μ-wire SN100C® B2012 gives fast and sustained wetting with low smoke and odour. For additional information please refer to the product data sheet.